H486-150-1.2A

Описание H486-150-1.2A

RS PRO Thermally Conductive Gap Filler Material, 3.2 W/m•K RS PRO range of mid performance thermally conductive gap filler which due to their flexible design allows them to fill the air gap between uneven surfaces. Thermal gap pads provide a thermal interface between heatsinks (devices or substances for absorbing unwanted or excess heat) and electronic devices. They’re particularly useful where air gaps, rough surface textures or uneven surface topography prevent the use of traditional grease or paste.

Thermal gap pads are solid at room temperature, but as heat rises, they grow softer and can fill gaps. Often, devices are not entirely flush with the heatsink, and when the pad grows soft, it can spread and fill that gap.

RS PRO have a great range of products for the heating or cooling of electronic devices, components or enclosures to help devices maintain the right temperature to work effectively.

Options include the following with various thicknesses:
707-4645 - 0.5mm,3.2W/mK
707-4654 - 0.8mm,3.2W/mK
707-4657 - 1.0mm,3.2W/mK
707-4651 - 1.2mm,3.2W/mK
707-4660 - 1.5mm,3.2W/mK
707-4663 - 2.0mm,3.2W/mK
707-4667 - 2.5mm,3.2W/mK
707-4676 - 3.0mm,3.2W/mK